CPC B23K 26/0626 (2013.01) [B23K 26/034 (2013.01); B23K 26/064 (2015.10)] | 4 Claims |
1. A laser machining device comprising:
a laser source configured to emit a laser beam;
an optical attenuator configured to irradiate, with the laser beam emitted from the laser source, a machining object or an irradiation object;
a heat radiation sensor configured to measure heat radiation of the irradiation object or the machining object irradiated with the laser beam by the optical attenuator;
a power meter configured to measure power of the laser beam on the irradiation object irradiated with the laser beam by the optical attenuator; and
a laser power control device that comprises a processor and a storage,
wherein the processor is configured to:
create relational data having a measurement value of the heat radiation of the irradiation object from the heat radiation sensor in association with a power value of the laser beam on the irradiation object from the power meter,
estimate power of the laser beam on the machining object based on a measurement value of the heat radiation sensor and the relational data stored in the storage, and
adjust power of the laser beam irradiated on the machining object based on an estimation result, and
wherein the storage is configured to store the relational data.
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