US 11,666,767 B2
Medical device lead connection assembly
Darren Janzig, Center City, MN (US); Robert J. Davies, Mounds View, MN (US); Seth M. Humphrys, Golden Valley, MN (US); and Richard T. Stone, Minneapolis, MN (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Appl. No. 16/91,290
Filed by MEDTRONIC, INC., Minneapolis, MN (US)
PCT Filed Apr. 13, 2017, PCT No. PCT/US2017/027339
§ 371(c)(1), (2) Date Oct. 4, 2018,
PCT Pub. No. WO2017/180827, PCT Pub. Date Oct. 19, 2017.
Claims priority of provisional application 62/323,080, filed on Apr. 15, 2016.
Prior Publication US 2019/0117982 A1, Apr. 25, 2019
Int. Cl. A61N 1/375 (2006.01); B23K 26/21 (2014.01); A61N 1/05 (2006.01); B23K 15/00 (2006.01); B23K 101/36 (2006.01); A61N 1/36 (2006.01)
CPC A61N 1/3752 (2013.01) [A61N 1/05 (2013.01); B23K 15/0046 (2013.01); B23K 26/21 (2015.10); A61N 1/0551 (2013.01); A61N 1/3605 (2013.01); B23K 2101/36 (2018.08)] 18 Claims
OG exemplary drawing
 
1. A method of forming a medical device lead connection element, comprising:
positioning an entire end portion of a lead filar to overlap a lead end connection element such that the positioning elastically deforms the lead end connection element or the end portion of the lead filar and creates mutual interference between the lead filar and the lead end connection element, and forming an interference configuration;
melting the entire end portion of the lead filar to form a weld joint and allow the end portion of the lead filar to move towards the end connection element; and
allowing the weld joint to cool.