US 11,659,729 B2
Electronic device substrate, manufacturing method and display device
Qun Ma, Beijing (CN); Zhiming Cui, Beijing (CN); and Dawei Wang, Beijing (CN)
Assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 16/336,715
Filed by CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Chengdu (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Sep. 6, 2018, PCT No. PCT/CN2018/104335
§ 371(c)(1), (2) Date Mar. 26, 2019,
PCT Pub. No. WO2019/109692, PCT Pub. Date Jun. 13, 2019.
Claims priority of application No. 201711284358.1 (CN), filed on Dec. 7, 2017.
Prior Publication US 2021/0367198 A1, Nov. 25, 2021
Int. Cl. H01L 51/52 (2006.01)
CPC H10K 50/844 (2023.02) [H10K 71/00 (2023.02); H10K 71/70 (2023.02)] 12 Claims
OG exemplary drawing
 
1. An electronic device substrate, comprising:
a base substrate;
an organic encapsulation layer being on the base substrate and comprising a main part and an edge part; and
a padding structure being provided on the base substrate and protruding from the base substrate, wherein
the edge part of the organic encapsulation layer at least partially covers the padding structure; and a part that is comprised by the padding structure and is away from the main part of the organic encapsulation layer has a height with respect to the base substrate greater than a height of another part that is comprised by the padding structure and is close to the main part of the organic encapsulation layer with respect to the base substrate;
the electronic device substrate further comprises a barrier wall, the barrier wall is on the base substrate and on a side of the padding structure close to an edge of the base substrate, an interval is between the barrier wall and the padding structure, a height of the barrier wall with respect to the base substrate is greater than a height of the padding structure with respect to the base substrate, and the organic encapsulation layer does not cover the barrier wall;
a side of the padding structure away from the barrier wall has a step structure, the step structure includes multiple connected plane parts, top surfaces of the multiple plane parts are parallel to the base substrate; and in a direction toward the barrier wall, heights of the multiple plane parts of the step structure with respect to the base substrate gradually increase; and
a side of the padding structure facing the barrier wall is inclined with respect to the base substrate and is not step-like.