US 11,658,391 B2
Antenna module
Hong Bok We, San Diego, CA (US); Aniket Patil, San Diego, CA (US); Jeahyeong Han, San Diego, CA (US); and Mohammad Ali Tassoudji, San Diego, CA (US)
Assigned to QUALCOMM INCORPORATED, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Dec. 21, 2020, as Appl. No. 17/129,084.
Prior Publication US 2022/0200166 A1, Jun. 23, 2022
Int. Cl. H01Q 1/52 (2006.01); H01Q 21/00 (2006.01); H01Q 23/00 (2006.01); H01Q 1/22 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/526 (2013.01); H01Q 21/0087 (2013.01); H01L 2223/6677 (2013.01); H01Q 23/00 (2013.01)] 49 Claims
OG exemplary drawing
 
1. A device, comprising:
a first antenna substrate including one or more antennas;
a metallization structure;
a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure; and
a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure,
wherein the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure,
wherein the first plurality of conductive elements is separated by air in the air gap; and
an electromagnetic interference (EMI) shield configured to at least partially enclose the metallization structure and a molded structure disposed on the metallization structure on a side opposite the first antenna substrate, wherein the molded structure comprises at least one electrical component electrically coupled to the metallization structure on a second side, which is opposite the first antenna substrate.