US 11,658,164 B2
Electronics card including multi-chip module
Chen-Hua Yu, Hsinchu (TW); Chien-Hsun Lee, Chu-tung Town (TW); and Jiun Yi Wu, Zhongli (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Feb. 8, 2021, as Appl. No. 17/170,224.
Application 17/170,224 is a division of application No. 16/160,516, filed on Oct. 15, 2018, granted, now 10,916,529.
Claims priority of provisional application 62/649,772, filed on Mar. 29, 2018.
Prior Publication US 2021/0167051 A1, Jun. 3, 2021
Int. Cl. H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01)
CPC H01L 25/105 (2013.01) [H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 23/49822 (2013.01); H01L 24/08 (2013.01); H01L 24/94 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/08225 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a first wafer comprising:
a first plurality of package components comprising first device dies;
a first encapsulant encapsulating the first plurality of package components therein; and
first redistribution lines interconnecting the first plurality of package components;
a second wafer bonded to the first wafer, wherein the second wafer comprises:
a second plurality of package components comprising second device dies;
a second encapsulant encapsulating the second plurality of package components therein; and
second redistribution lines interconnecting the second plurality of package components;
a printed circuit board, wherein the second wafer is attached to the printed circuit board; and
electrical connections connecting first bond pads on the second wafer to bond pads on the printed circuit board.