CPC H01L 25/105 (2013.01) [H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 23/49822 (2013.01); H01L 24/08 (2013.01); H01L 24/94 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/08225 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01)] | 20 Claims |
1. A package comprising:
a first wafer comprising:
a first plurality of package components comprising first device dies;
a first encapsulant encapsulating the first plurality of package components therein; and
first redistribution lines interconnecting the first plurality of package components;
a second wafer bonded to the first wafer, wherein the second wafer comprises:
a second plurality of package components comprising second device dies;
a second encapsulant encapsulating the second plurality of package components therein; and
second redistribution lines interconnecting the second plurality of package components;
a printed circuit board, wherein the second wafer is attached to the printed circuit board; and
electrical connections connecting first bond pads on the second wafer to bond pads on the printed circuit board.
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