CPC H01L 21/7684 (2013.01) [C09G 1/02 (2013.01); C09K 3/1463 (2013.01); C09K 3/1481 (2013.01); H01L 21/3212 (2013.01); H01L 21/76877 (2013.01)] | 20 Claims |
1. A chemical-mechanical polishing (CMP) slurry composition, comprising:
a first oxidizer comprising halogen oxyacid or its salt;
a second oxidizer comprising aqueous ozone (O3); and
one or more abrasive particles,
wherein an ozone concentration of the aqueous ozone is between approximately 200 parts per million (ppm) and approximately 7000 ppm.
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