US 11,657,841 B2
Flexible printed circuit offset finger stiffener
Teruhiro Nakamiya, Setagaya-ku (JP); Kazuhiro Nagaoka, Fujisawa (JP); Satoshi Nakamura, Yokohama (JP); and Nobuyuki Okunaga, Kawasaki (JP)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Jun. 23, 2021, as Appl. No. 17/356,277.
Prior Publication US 2022/0415346 A1, Dec. 29, 2022
Int. Cl. G11B 5/48 (2006.01); G11B 5/596 (2006.01); H05K 1/02 (2006.01)
CPC G11B 5/486 (2013.01) [G11B 5/4846 (2013.01); G11B 5/59605 (2013.01); H05K 1/0201 (2013.01); H05K 1/0209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flexible printed circuit (FPC) comprising:
a plurality of fingers extending from a main portion, each finger comprising:
a thermally-conductive stiffener having an upper side having a top edge, a lower side having a bottom edge, a proximal end, and a distal end that is narrower than the proximal end,
at least one wiring layer over the stiffener, and
a cover film over the at least one wiring layer and having an upper side having a top edge, a lower side having a bottom edge, a proximal end, and a distal end that is narrower than the proximal end;
wherein the centroid of the stiffener is offset from the centerline of the cover film.