US 11,657,532 B2
Surface profile estimation and bump detection for autonomous machine applications
Minwoo Park, Saratoga, CA (US); Yue Wu, Mountain View, CA (US); Michael Grabner, Redmond, WA (US); and Cheng-Chieh Yang, Sunnyvale, CA (US)
Assigned to NVIDIA Corporation, Santa Clara, CA (US)
Filed by NVIDIA Corporation, Santa Clara, CA (US)
Filed on Nov. 24, 2020, as Appl. No. 17/103,680.
Claims priority of provisional application 62/946,689, filed on Dec. 11, 2019.
Prior Publication US 2021/0183093 A1, Jun. 17, 2021
Int. Cl. G06T 7/60 (2017.01); G06T 7/579 (2017.01); G06V 20/56 (2022.01)
CPC G06T 7/60 (2013.01) [G06T 7/579 (2017.01); G06V 20/588 (2022.01); G06T 2200/08 (2013.01); G06T 2207/10028 (2013.01); G06T 2207/30256 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A processor comprising:
one or more circuits to:
determine a three-dimensional (3D) point cloud of points within a free-space region;
determine, for at least a bounding shape of one or more bounding shapes, a height relative to a surface based at least on one or more points of the 3D point cloud that are associated with the bounding shape;
determine, based at least on the height associated with the bounding shape, a surface profile associated with the surface; and
perform, based at least on the surface profile, one or more operations.