US 11,656,663 B2
Thermal management systems for wearable components
Michael Janusz Woods, Mountain View, CA (US); and Paul M. Greco, Parkland, FL (US)
Assigned to MAGIC LEAP, INC., Plantation, FL (US)
Filed by Magic Leap, Inc., Plantation, FL (US)
Filed on Dec. 4, 2020, as Appl. No. 17/112,232.
Application 17/112,232 is a continuation of application No. 15/814,099, filed on Nov. 15, 2017, granted, now 10,860,070.
Claims priority of provisional application 62/423,192, filed on Nov. 16, 2016.
Prior Publication US 2021/0089095 A1, Mar. 25, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 1/20 (2006.01); G02B 27/01 (2006.01); B32B 27/12 (2006.01); G06F 1/16 (2006.01)
CPC G06F 1/203 (2013.01) [B32B 27/12 (2013.01); G02B 27/0149 (2013.01); G06F 1/163 (2013.01); B32B 2307/302 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A wearable component configured to be worn on a head of a user, the wearable component including a user surface configured to face the head of the user when worn by the user and an outside surface opposite the user surface and spaced from the user surface along a first direction non-parallel to the user surface, the outside surface configured to face away from the head of the user when worn by the user, the wearable component comprising:
a wearable support having a thickness along the first direction;
an electronic component in thermal communication with the wearable support; and
a thermal management structure in thermal communication with the electronic component, the thermal management structure comprising a thermally conductive structure extending through at least a portion of the thickness of the wearable support and configured to transfer heat along the first direction from the electronic component away from the user surface of the wearable component towards the outside surface of the wearable component,
wherein the thermally conductive structure comprises a thermally conductive planar member in thermal communication with the electronic component and a thermally conductive via coupled to or formed with the planar member, the thermally conductive via extending non-parallel from the planar member such that the planar member is disposed between the thermally conductive via and the electronic component, the thermal management structure comprising a plurality of layers disposed about the thermally conductive via.