CPC G01N 27/3274 (2013.01) [A61B 5/1495 (2013.01); A61B 5/14532 (2013.01); A61B 2560/0223 (2013.01)] | 36 Claims |
1. A preconnected sensor assembly comprising:
a sensor having at least one electrical contact, the sensor configured to sense an analyte concentration;
a housing;
sensor electronics;
an interposer having:
a substrate to mechanically interface the sensor with the sensor electronics, and
a contact electrically coupled with the at least one electrical contact of the sensor, the contact disposed on an external surface of the interposer, the contact configured to electrically interface the sensor with the sensor electronics; and
a package, the sensor and the sensor electronics being positioned within the package, the sensor preconnected to the sensor electronics via the interposer,
wherein the substrate of the interposer is configured to mechanically interface with the housing and with one or more manufacturing equipment for allowing measurement of at least one sensor property via the interposer.
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