US 11,656,126 B2
Heat treatment apparatus and temperature control method
Kazuteru Obara, Oshu (JP); Koji Yoshii, Oshu (JP); Yuki Wada, Oshu (JP); and Hitoshi Kikuchi, Oshu (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Nov. 15, 2019, as Appl. No. 16/685,047.
Application 16/685,047 is a division of application No. 15/191,599, filed on Jun. 24, 2016, granted, now 10,533,896.
Claims priority of application No. 2015-130165 (JP), filed on Jun. 29, 2015.
Prior Publication US 2020/0080895 A1, Mar. 12, 2020
Int. Cl. C23C 16/52 (2006.01); G01J 5/00 (2022.01); C23C 16/40 (2006.01); C23C 16/46 (2006.01); C23C 16/458 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); G05D 23/19 (2006.01); H01L 21/67 (2006.01); G02B 26/12 (2006.01); G01J 5/07 (2022.01)
CPC G01J 5/0007 (2013.01) [C23C 16/402 (2013.01); C23C 16/4584 (2013.01); C23C 16/45551 (2013.01); C23C 16/46 (2013.01); C23C 16/52 (2013.01); G01J 5/07 (2022.01); G02B 26/12 (2013.01); G05D 23/1931 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/67248 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A temperature control method used in a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting a set of a plurality of substrates on a surface of a rotary table installed inside a processing vessel and heating the plurality of substrates by a heating part while rotating the rotary table, the temperature control method comprising:
mounting a set of a plurality of substrates on the rotary table;
measuring, by a contact type thermocouple, a temperature of the heating part;
measuring, by a non-contact type radiation temperature measuring part, a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and
controlling, by a temperature controller, the thermocouple and the radiation temperature measuring part to perform a process including:
prior to performing the predetermined film forming process, mounting a set of a plurality of dummy substrates on the rotary table, measuring a first measurement value for a temperature of the heating part by the thermocouple, measuring a second measurement value for a temperature of the plurality of dummy substrates by the radiation temperature measuring part in a state where the rotary table is being rotated, tabulating a correlation between the first measurement value and the second measurement value, and storing the tabulated correlation between the first measurement value and the second measurement value into a storage part;
determining, by the temperature controller, whether the second measurement value is the temperature of the plurality of dummy substrates or a temperature of the rotary table; and
after storing the tabulated correlation, performing the predetermined film forming process on additional sets of a plurality of substrates while controlling the heating part based on the tabulated correlation stored in the storage part,
wherein the thermocouple and the radiation temperature measuring part measure temperatures in a plurality of regions defined along a diameter direction of the rotary table.