	US 11,655,348 B2
	Method for manufacturing polyimide composite film for flexible metal-clad substrate
Jia-Hao Wu, Hsinchu Hsien (TW); Chia-Ying Chou, Hsinchu Hsien (TW); and Chun-Yi Cheng, Hsinchu Hsien (TW)
Assigned to TAIMIDE TECHNOLOGY INCORPORATION, Hsinchu Hsien (TW)
Filed by TAIMIDE TECHNOLOGY INCORPORATION, Hsinchu Hsien (TW)
Filed on Jun. 23, 2021, as Appl. No. 17/355,204.
Prior Publication US 2022/0411594 A1, Dec. 29, 2022
Int. Cl. C08J 5/18 (2006.01); C08J 7/04 (2020.01); C08J 3/11 (2006.01); C08G 73/10 (2006.01); C08J 3/24 (2006.01); C08L 33/24 (2006.01)

CPC C08J 5/18 (2013.01) [C08G 73/1003 (2013.01); C08J 3/11 (2013.01); C08J 3/247 (2013.01); C08J 7/0427 (2020.01); C08L 33/24 (2013.01); C08J 2333/24 (2013.01)]

7 Claims

1. A method for manufacturing a polyimide composite film for a flexible metal-clad substrate to attach a metal foil to the polyimide composite film, comprising:

providing a polyamide acid solution;

providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion, wherein a solid weight percentage of the fluorine polymer particle dispersion is greater than 30 wt %, wherein the fluorine polymer particle dispersion further includes a polyamide acid solution;

forming a colloidal polyimide film from the polyamide acid solution, wherein a thickness of the colloidal polyimide film is greater than 12 μm; and

coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.