US 11,654,279 B2
Applying tumor treating fields (TTFields) via electrodes embedded into skull implants
Yoram Wasserman, Haifa (IL); Uri Weinberg, Binyamina (IL); and Zeev Bomzon, Kiryat Tivon (IL)
Assigned to Novocure GmbH, Root (CH)
Filed by Novocure GmbH, Root (CH)
Filed on Jul. 24, 2020, as Appl. No. 16/937,695.
Claims priority of provisional application 62/880,893, filed on Jul. 31, 2019.
Prior Publication US 2021/0031031 A1, Feb. 4, 2021
Int. Cl. A61N 1/36 (2006.01); A61N 1/04 (2006.01); A61N 1/05 (2006.01); A61N 1/40 (2006.01)
CPC A61N 1/36002 (2017.08) [A61N 1/0488 (2013.01); A61N 1/0529 (2013.01); A61N 1/36017 (2013.01); A61N 1/40 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus comprising
a rigid substrate shaped and dimensioned to replace a section of a skull, the substrate having an inner side and an outer side opposed to the inner side;
an electrically conductive plate having an inner side and an outer side, wherein the outer side of the plate is affixed to the inner side of the substrate;
a dielectric layer disposed on the inner side of the plate; and
an electrically conductive lead having an inner end and an outer end, wherein the inner end of the lead is disposed in electrical contact with the plate, wherein the lead passes through the substrate from a point on the inner side of the substrate to a point on the outer side of the substrate, and wherein the outer end of the lead extends outwardly from the outer side of the substrate and is configured to accept an electrical signal from an external device.