US 11,012,642 B2
Edgeless large area camera system
Farah Fahim, Glen Ellyn, IL (US); Grzegorz W. Deptuch, Forest Park, IL (US); Pawel Grybos, Rząska (PL); Robert Szczygiel, Cracow (PL); Piotr Maj, Cracow (PL); Piotr Kmon, Niepołomice (PL); David Peter Siddons, Cutchogue, NY (US); Joseph Mead, Manorville, NY (US); Abdul Khader Rumaiz, Nesconset, NY (US); Robert Kent Bradford, Aurora, IL (US); and John Thomas Weizeorick, III, Naperville, IL (US)
Assigned to FERMI RESEARCH ALLIANCE, LLC, Batavia, IL (US)
Filed by Fermi Research Alliance, LLC, Batavia, IL (US)
Filed on Sep. 6, 2018, as Appl. No. 16/123,857.
Application 16/123,857 is a division of application No. 15/214,933, filed on Jul. 20, 2016, granted, now 10,075,657.
Claims priority of provisional application 62/195,053, filed on Jul. 21, 2015.
Prior Publication US 2019/0089913 A1, Mar. 21, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01); H04N 5/32 (2006.01); G01N 23/2055 (2018.01)
CPC H04N 5/32 (2013.01) [G01N 23/2055 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of configuring a detecting apparatus comprising:
electronically and mechanically connecting a motherboard to at least one dead-zone-less detector module having an electrical substrate;
providing a multi-tier 3D integrated ASIC (Application-Specific Integrated Circuit) comprising at least one analog tier and at least one digital tier connected to at least one segmented sensor;
bonding at least one tier of said multi-tier 3D integrated ASIC to said at least one segmented sensor;
bonding at least one tier of said multi-tier 3D integrated ASIC to said electrical substrate of said at least one dead-zone-less detector module;
mounting at least one data processing, computation, and transmission circuit, wherein said at least one data processing, computation, and transmission circuit, onto a side of said at least one dead-zone-less detector module opposite said at least one multi-tier 3D integrated ASIC; and
configuring a thermal management system comprising a cooling system that includes a chiller and a heat exchanger, wherein said heat exchanger is located within a detecting apparatus head and between said motherboard and said at least one dead-zone-less detector module.