CPC H05K 7/2039 (2013.01) [G06F 1/203 (2013.01); H05K 7/20136 (2013.01); H05K 7/20336 (2013.01)] | 8 Claims |
1. An electronic apparatus comprising:
a chassis;
first and second heating elements in the chassis; and
a cooling module in the chassis, the cooling module absorbing heat generated from the first and second heating elements,
the cooling module comprising:
a first vapor chamber connected to the first heating element and including two first metal plates defining a first closed space therebetween to contain a first working fluid in the first closed space; and
a second vapor chamber connected to the second heating element and including two second metal plates defining a second closed space therebetween to contain a second working fluid in the second closed space;
the first and second vapor chambers being side-by-side to each other with a step therebetween,
the first vapor chamber having a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward to a surface of the second vapor chamber,
the bridge being outside of the first and second closed spaces.
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