US 11,968,806 B2
Electronic apparatus and cooling module
Masahiro Kitamura, Yokohama (JP); Yusuke Onoue, Yokohama (JP); Takuroh Kamimura, Yokohama (JP); and Akinori Uchino, Yokohama (JP)
Assigned to LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed by LENOVO (SINGAPORE) PTE. LTD., Singapore (SG)
Filed on Jun. 2, 2022, as Appl. No. 17/805,043.
Claims priority of application No. 2021-139056 (JP), filed on Aug. 27, 2021.
Prior Publication US 2023/0069684 A1, Mar. 2, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/2039 (2013.01) [G06F 1/203 (2013.01); H05K 7/20136 (2013.01); H05K 7/20336 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic apparatus comprising:
a chassis;
first and second heating elements in the chassis; and
a cooling module in the chassis, the cooling module absorbing heat generated from the first and second heating elements,
the cooling module comprising:
a first vapor chamber connected to the first heating element and including two first metal plates defining a first closed space therebetween to contain a first working fluid in the first closed space; and
a second vapor chamber connected to the second heating element and including two second metal plates defining a second closed space therebetween to contain a second working fluid in the second closed space;
the first and second vapor chambers being side-by-side to each other with a step therebetween,
the first vapor chamber having a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward to a surface of the second vapor chamber,
the bridge being outside of the first and second closed spaces.