US 11,968,802 B2
Heat sink, heat sink arrangement and module for liquid immersion cooling
David Amos, Rotheram (GB); Neil Edmunds, Rotheram (GB); Andrew Young, Rotheram (GB); Jasper Kidger, Rotheram (GB); and Nathan Longhurst, Rotheram (GB)
Assigned to Iceotope Group Limited, South Yorkshire (GB)
Filed by ICEOTOPE GROUP LIMITED, Rotheram (GB)
Filed on Mar. 16, 2023, as Appl. No. 18/122,431.
Application 18/122,431 is a continuation of application No. 17/678,387, filed on Feb. 23, 2022, granted, now 11,653,472.
Application 17/678,387 is a continuation of application No. 17/354,769, filed on Jun. 22, 2021, granted, now 11,369,040, issued on Jun. 21, 2022.
Application 17/354,769 is a continuation of application No. 16/645,166, granted, now 11,096,313, issued on Aug. 17, 2021, previously published as PCT/GB2018/052526, filed on Sep. 6, 2018.
Claims priority of application No. 1714304 (GB), filed on Sep. 6, 2017; application No. 1714308 (GB), filed on Sep. 6, 2017; application No. 1714313 (GB), filed on Sep. 6, 2017; and application No. 1809681 (GB), filed on Jun. 13, 2018.
Prior Publication US 2023/0217629 A1, Jul. 6, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/473 (2006.01)
CPC H05K 7/20236 (2013.01) [H01L 23/3677 (2013.01); H01L 23/473 (2013.01); H05K 7/20263 (2013.01); H05K 7/2039 (2013.01); H05K 7/20772 (2013.01); H05K 7/20781 (2013.01); H05K 7/20927 (2013.01); H01L 23/4735 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A cooling module for a plurality of electronic devices, comprising:
a container, for housing the plurality of electronic devices and a liquid coolant, so that the liquid coolant can at least partially immerse the plurality of electronic devices; and
a heat sink, mounted in the container and having a wall arrangement to define an internal volume, in which one of the plurality of electronic devices is mounted and in which the liquid coolant accumulates around the one of the plurality of electronic device in operation, such that heat is transferred from the one of the plurality of electronic devices to the liquid coolant held in the internal volume and such that the one of the plurality of electronic devices is at least partially immersed in the liquid coolant; and
wherein the wall arrangement of the heat sink comprises:
a base, configured for mounting the heat sink within the cooling module; and
a retaining wall extending from the base, the base and retaining wall defining the internal volume for accumulating the liquid coolant; and
wherein the liquid coolant can flow over the retaining wall and out of the internal volume into the container and wherein the wall arrangement is arranged such that a level of liquid coolant held within the internal volume is higher than a level of coolant in the container external the internal volume;
wherein the liquid coolant that flows out of the internal volume into the container is the same liquid coolant in which the one of the plurality of electronic devices is at least partially immersed.