US 11,968,795 B2
Structural midframe for an electronic device having a camera and a speaker
Laurie Man Sum Kwan, San Francisco, CA (US); Cindy Ngoc-Tran Au, Milpitas, CA (US); Timothy Michael Vanderet, Berkeley, CA (US); and Cheng-jung Lee, San Jose, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Apr. 12, 2023, as Appl. No. 18/299,597.
Application 18/299,597 is a continuation of application No. 17/026,883, filed on Sep. 21, 2020, granted, now 11,659,677.
Prior Publication US 2023/0262918 A1, Aug. 17, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/14 (2006.01); F16M 11/04 (2006.01); F16M 11/14 (2006.01); F16M 13/02 (2006.01); G03B 17/56 (2021.01); G08B 13/196 (2006.01); H01Q 1/24 (2006.01); H01Q 9/04 (2006.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 7/20 (2006.01)
CPC H05K 7/1417 (2013.01) [F16M 11/041 (2013.01); F16M 11/14 (2013.01); F16M 13/02 (2013.01); F16M 13/022 (2013.01); F16M 13/027 (2013.01); G03B 17/561 (2013.01); G08B 13/19617 (2013.01); H01Q 1/24 (2013.01); H01Q 9/0407 (2013.01); H04N 23/51 (2023.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H05K 7/2039 (2013.01); G08B 13/19654 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing member;
a midframe forming a structural frame for the electronic device, the midframe positioned within the housing member, the midframe having an outer surface at least a portion of which faces an interior surface of the housing member; and
a plurality of components assembled onto the midframe, the plurality of components comprising:
a wireless-network antenna assembled onto the outer surface of the midframe, the wireless-network antenna being mounted on a flexible printed circuit board, the outer surface of the midframe including a substantially planar region configured to interface with at least a portion of the wireless-network antenna;
a camera subassembly assembled onto the midframe;
one or more printed circuit boards assembled onto the midframe; and
a speaker module assembled onto the midframe.