CPC H05K 1/144 (2013.01) [H01R 12/52 (2013.01); H01R 12/57 (2013.01); H01R 12/7082 (2013.01); H01R 31/06 (2013.01); H05K 1/111 (2013.01); H01R 12/721 (2013.01); H01R 12/75 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10189 (2013.01)] | 20 Claims |
1. An electronic device comprises:
a main board; and
a wireless communication board connected to the main board,
wherein the main board comprises:
a main circuit board;
a main processor disposed on the main circuit board and configured to control the electronic device;
a communication connection provided on the main circuit board and connected to the wireless communication board; and
a main power supply disposed on the main circuit board and configured to supply power to the main processor and the wireless communication board,
wherein the wireless communication board comprises:
a communication board;
a wireless communication part disposed on the communication board;
a power supply disposed on the communication board and configured to supply power to the wireless communication part;
a surface mounting pad connected to the wireless communication part and the power supply, formed on the communication board disposed on the main board by surface mounting technology; and
a wire connection connected to the wireless communication part and the power supply, provided on the communication board connected to the main board with a wire, and
wherein the communication connection of the main board is formed to correspond to one of the surface mounting pad and the wire connection of the wireless communication board.
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