US 11,968,776 B2
Method for mechanical packaging for modular energy system
Madeleine C. Jayme, Cincinnati, OH (US); Ryan M. Asher, Cincinnati, OH (US); William B. Weisenburgh, II, Maineville, OH (US); Joshua E. Henderson, Cincinnati, OH (US); Stephen D. Geresy, West Chester, OH (US); Stephen M. Leuck, Milford, OH (US); John A. Weed, III, Monroe, OH (US); Brendan J. Oberkircher, Cincinnati, OH (US); and Kristen G. Denzinger, Cincinnati, OH (US)
Assigned to Cilag GmbH International, Zug (CH)
Filed by Cilag GmbH International, Zug (CH)
Filed on Mar. 30, 2021, as Appl. No. 17/217,394.
Prior Publication US 2022/0322523 A1, Oct. 6, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/02 (2006.01); G02F 1/1333 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01)
CPC H05K 1/0263 (2013.01) [G02F 1/133325 (2021.01); H05K 1/185 (2013.01); H05K 7/1459 (2013.01); Y10T 29/49208 (2015.01)] 19 Claims
OG exemplary drawing
 
1. A method of assembling a backplane connector subassembly for a module of a modular energy system, wherein the backplane connector subassembly physically and electrically connects at least two modules stacked on top of one another, the method comprising:
providing a back panel defining an inner surface;
attaching a first support member to the inner surface of the back panel, wherein the first support member is configured to support an upstream connector;
attaching a second support member to the inner surface of the back panel, wherein the second support member is configured to support a downstream connector;
attaching a support ledge to the inner surface of the back panel between the first and second support members;
attaching the upstream connector to the back panel by sliding a first mating hole defined in the upstream connector onto the first support member; and
attaching the downstream connector to the back panel by sliding a second mating hole defined in the downstream connector onto the second support member.