US 11,967,759 B2
Antenna module and electronic device including the same
Soon Park, Suwon-si (KR); Yeonwoo Kim, Suwon-si (KR); Haekwon Lee, Suwon-si (KR); Woosup Lee, Suwon-si (KR); and Hyoseok Na, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 21, 2022, as Appl. No. 17/990,778.
Application 17/990,778 is a continuation of application No. 16/911,856, filed on Jun. 25, 2020, granted, now 11,509,046.
Claims priority of application No. 10-2019-0086184 (KR), filed on Jul. 17, 2019.
Prior Publication US 2023/0083408 A1, Mar. 16, 2023
Int. Cl. H01Q 1/38 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 1/38 (2013.01) [H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first printed circuit board (PCB);
a second PCB spaced from the first PCB;
at least one first patch antenna element disposed on a first surface of the first PCB;
at least one second patch antenna element disposed on at least one surface of the second PCB;
a radio frequency integrated circuit (RFIC) disposed on a second surface of the first PCB; and
an interposer disposed between at least the first PCB and the second PCB, and configured to electrically connect the RFIC to the at least one second patch antenna.