US 11,967,758 B2
Printed circuit board structure including a closed cavity
Ki Wook Lee, Irvine, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Nov. 15, 2022, as Appl. No. 17/987,610.
Application 17/987,610 is a continuation of application No. 16/883,631, filed on May 26, 2020, granted, now 11,527,819.
Application 16/883,631 is a continuation of application No. 15/967,976, filed on May 1, 2018, granted, now 10,700,424, issued on Jun. 30, 2020.
Claims priority of provisional application 62/502,502, filed on May 5, 2017.
Prior Publication US 2023/0187820 A1, Jun. 15, 2023
Int. Cl. H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/36 (2006.01); H01Q 9/04 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01)
CPC H01Q 1/38 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/2291 (2013.01); H01Q 1/242 (2013.01); H01Q 1/36 (2013.01); H01Q 9/0407 (2013.01); H05K 1/0224 (2013.01); H05K 1/115 (2013.01); H05K 3/42 (2013.01); H05K 3/4697 (2013.01); H05K 3/0026 (2013.01); H05K 3/027 (2013.01); H05K 3/06 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1178 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A closed cavity printed circuit board comprising:
a core layer;
a first metal layer and a second metal layer; and
a first adhesive layer and a second adhesive layer, the first adhesive layer and the first metal layer forming a top cover attached to a top surface of the core layer and the second adhesive layer and the second metal layer forming a bottom cover attached to a bottom surface of the core layer, a cavity of a closed cavity antenna having walls defined by the bottom cover, the top cover, and a hole extending through a thickness of the core layer.