US 11,967,586 B2
Micro LED based display panel
Dmitry S. Sizov, Cupertino, CA (US); Ion Bita, Santa Clara, CA (US); Jean-Jacques P. Drolet, Bavaria (DE); John T. Leonard, San Jose, CA (US); Jonathan S. Steckel, Cupertinov, CA (US); Nathaniel T. Lawrence, San Francisco, CA (US); Xiaobin Xin, Sunnyvale, CA (US); and Ranojoy Bose, Fremont, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jun. 29, 2022, as Appl. No. 17/809,785.
Application 17/809,785 is a continuation of application No. 16/960,480, granted, now 11,404,400, previously published as PCT/US2019/014595, filed on Jan. 22, 2019.
Claims priority of provisional application 62/621,367, filed on Jan. 24, 2018.
Prior Publication US 2023/0018406 A1, Jan. 19, 2023
Int. Cl. H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 33/60 (2013.01); H01L 33/0008 (2013.01); H01L 33/0093 (2020.05); H01L 33/38 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/32225 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A light emitting structure comprising:
a substrate including a top bonding surface including a top surface dielectric bonding layer and an array of electrode pads;
an emission layer stack-up hybrid bonded to the top bonding surface of the substrate, the emission layer stack-up including:
an array of light emitting diodes (LEDs);
an array of reflective metal layers, wherein each reflective metal layer spans laterally around and underneath a corresponding LED, and each reflective metal layer is in electrical contact with a bottom surface of a corresponding LED;
a dielectric bonding layer spanning underneath the array of LEDs; and
an array of bond posts directly connected to the array of reflective metal layers and extending through the dielectric bonding layer;
wherein each bond post is metal-metal bonded with an electrode pad of the substrate, and the dielectric bonding layer is directly bonded with the top surface dielectric bonding layer of the substrate.