CPC H01L 25/0655 (2013.01) [H01L 23/3731 (2013.01); H01L 23/49822 (2013.01); H01L 25/50 (2013.01)] | 20 Claims |
1. A multi-chip device, comprising:
a substrate;
a first material between a first sidewall of the substrate and a second sidewall of the substrate and extending from a top surface of the substrate to a bottom surface of the substrate, wherein the first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate; and
a first chip overlying the first material and overlying the substrate to overlap an interface between the first material and the substrate.
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