US 11,967,581 B2
Package structures having underfills
Jinwoo Park, Suwon-si (KR); Unbyoung Kang, Suwon-si (KR); Jongho Lee, Suwon-si (KR); and Teakhoon Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 16, 2023, as Appl. No. 18/110,446.
Application 18/110,446 is a continuation of application No. 17/168,238, filed on Feb. 5, 2021, granted, now 11,587,906.
Claims priority of application No. 10-2020-0085452 (KR), filed on Jul. 10, 2020.
Prior Publication US 2023/0197681 A1, Jun. 22, 2023
Int. Cl. H01L 23/16 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/0652 (2013.01) [H01L 23/16 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3675 (2013.01); H01L 23/562 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a lower substrate;
substrate connection terminals on the lower substrate;
a semiconductor package on the substrate connection terminals, the semiconductor package including a package substrate and an encapsulant covering the package substrate; and
a first underfill and a second underfill between the lower substrate and the semiconductor package, the first underfill including:
an inner portion overlapping the semiconductor package in a vertical direction, the inner portion covering at least one of the substrate connection terminals, and
an outer portion not overlapping the semiconductor package in the vertical direction.