US 11,967,569 B2
Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
Michael Lee Dawson, McKinney, TX (US); Edward J. Pryor, III, Royse City, TX (US); Jeffrey L. Large, Richardson, TX (US); and Mary Coles, Dallas, TX (US)
Assigned to Texas Instruments Incorporated, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Dec. 17, 2021, as Appl. No. 17/555,107.
Application 17/555,107 is a division of application No. 16/592,102, filed on Oct. 3, 2019, granted, now 11,233,017.
Prior Publication US 2022/0108960 A1, Apr. 7, 2022
Int. Cl. H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01L 49/02 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 23/66 (2013.01); H01L 28/10 (2013.01); H01Q 1/2283 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A method comprising:
attaching a first portion of a preformed metal micro-wire to a multilayer structure, the preformed metal micro-wire having been fabricated separate from the multilayer structure.