US 11,967,559 B2
Electronic package
Chang Chi Lee, Kaohsiung (TW); Chiu-Wen Lee, Kaohsiung (TW); and Jung Jui Kang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Nov. 24, 2021, as Appl. No. 17/535,400.
Prior Publication US 2023/0163077 A1, May 25, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5384 (2013.01) [H01L 23/5386 (2013.01); H01L 25/0655 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An electronic package comprising:
a semiconductor substrate comprising a first active region and a first passive region separated from the first active region, wherein the first active region is configured to regulate a power signal, and the first passive region is configured to transmit a data signal,
wherein the first active region comprises a conductive through via having a resistance lower than a resistance of a conductive through via of the first passive region,
wherein the first active region comprises a plurality of the conductive through vias, and
wherein a size of the conductive through via of the first active region is different from a size of the conductive through via of the first passive region.