US 11,967,540 B2
Integrated circuit direct cooling systems having substrates in contact with a cooling medium
Seungwon Im, Bucheon-si (KR); Oseob Jeon, Seoul (KR); Byoungok Lee, Bucheon-si (KR); Yoonsoo Lee, Incheon (KR); Joonseo Son, Seoul (KR); Dukyong Lee, Cheon-an (KR); and Changyoung Park, Ilsan-si (KR)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Dec. 1, 2021, as Appl. No. 17/457,100.
Application 17/457,100 is a division of application No. 16/790,933, filed on Feb. 14, 2020, granted, now 11,201,105.
Application 16/790,933 is a division of application No. 15/714,539, filed on Sep. 25, 2017, granted, now 10,607,919, issued on Mar. 31, 2020.
Claims priority of provisional application 62/491,948, filed on Apr. 28, 2017.
Prior Publication US 2022/0093487 A1, Mar. 24, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 23/13 (2006.01); H01L 23/433 (2006.01); H01L 23/473 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/24 (2006.01)
CPC H01L 23/433 (2013.01) [H01L 23/13 (2013.01); H01L 23/4334 (2013.01); H01L 23/473 (2013.01); H01L 23/49568 (2013.01); H01L 23/49861 (2013.01); H01L 25/0657 (2013.01); H01L 23/24 (2013.01); H01L 2224/33 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first cover coupled to a first substrate, the first substrate coupled to a first die;
a first cooling system positioned between an inner face of the first substrate and an outer face of the first cover;
a second cover coupled to a second substrate, the second substrate coupled to a second die;
a second cooling system positioned between an inner face of the second substrate and an outer face of the second cover; and
a spacer coupled between the first die and the second die;
wherein the first cooling system and the second cooling system each comprise a flow control device configured to induce turbulent flow of a cooling medium passing through the first cooling system and the second cooling system;
wherein the first substrate and the second substrate are configured to contact the cooling medium; and
wherein each substrate of the semiconductor package is directly coupled to one of the first cover or the second cover.
 
9. A semiconductor package comprising:
a first cover coupled to a first substrate, the first substrate coupled to a first die;
a first cooling system comprised in the first cover and positioned between an inner face of the first substrate and an outer face of the first cover;
a second cover coupled to a second substrate, the second substrate coupled to a second die;
a second cooling system comprised in the second cover and positioned between an inner face of the second substrate and an outer face of the second cover; and
a spacer coupled between the first die and the second die;
wherein the first cooling system and the second cooling system each comprise a heat slug with fins; and
wherein the first substrate and the second substrate are configured to contact a cooling medium configured to pass through the first cooling system and the second cooling system.
 
13. A semiconductor package comprising:
a first cover coupled to a first substrate, the first substrate coupled to a first die;
a first cooling system comprised in the first cover and positioned between an inner face of the first substrate and an outer face of the first cover;
a second cover coupled to a second substrate, the second substrate coupled to a second die;
a second cooling system comprised in the second cover and positioned between an inner face of the second substrate and an outer face of the second cover; and
a spacer coupled between the first die and the second die;
wherein the first cooling system and the second cooling system each comprise a flow control device configured to induce turbulent flow of a cooling medium passing through the first cooling system and the second cooling system;
wherein the first substrate and the second substrate are configured to contact the cooling medium; and
wherein each substrate of the semiconductor package is directly coupled to one of the first cover or the second cover.