US 11,967,535 B2
On-product overlay targets
Amnon Manassen, Haifa (IL); Vladimir Levinski, Migdal Ha'emek (IL); Ido Dolev, Manof (IL); and Yoram Uziel, Yodfat (IL)
Assigned to KLA CORPORATION, Milpitas, CA (US)
Filed by KLA CORPORATION, Milpitas, CA (US)
Filed on Nov. 4, 2021, as Appl. No. 17/519,512.
Claims priority of provisional application 63/227,295, filed on Jul. 29, 2021.
Claims priority of provisional application 63/174,045, filed on Apr. 13, 2021.
Prior Publication US 2022/0328365 A1, Oct. 13, 2022
Int. Cl. H01L 21/66 (2006.01); G03F 7/00 (2006.01); H01L 23/544 (2006.01)
CPC H01L 22/12 (2013.01) [G03F 7/70633 (2013.01); G03F 7/70683 (2013.01); H01L 22/30 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A product, comprising:
a semiconductor substrate;
at least first and second thin-film layers disposed on the substrate and patterned to define a matrix of dies, which are separated by scribe lines and contain active areas circumscribed by the scribe lines; and
a plurality of overlay targets formed in the first and second thin-film layers within each of the active areas, each overlay target having dimensions no greater than 10 μm×10 μm in a plane parallel to the substrate and comprising:
a first linear grating formed in the first thin-film layer and having a first grating vector; and
a second linear grating formed in the second thin-film layer, in proximity to the first linear grating, and having a second grating vector parallel to the first grating vector.