CPC H01L 21/4842 (2013.01) [H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49503 (2013.01); H01L 23/49548 (2013.01)] | 20 Claims |
1. A semiconductor device comprising:
a leadframe having a plurality of conductive leads and a flag;
a semiconductor die attached to the flag of the leadframe; and
a molding compound encapsulating the semiconductor die and a portion of the leadframe, an angled cavity formed in the molding compound at an end of the semiconductor device substantially perpendicular to the flag, the angled cavity formed at an angle different from a plane of the flag.
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