US 11,967,497 B2
Methods and apparatus for cleaning semiconductor wafers
Jun Wang, Shanghai (CN); Hui Wang, Shanghai (CN); Fufa Chen, Shanghai (CN); Fuping Chen, Shanghai (CN); Jian Wang, Shanghai (CN); Xi Wang, Shanghai (CN); Xiaoyan Zhang, Shanghai (CN); Yinuo Jin, Shanghai (CN); Zhaowei Jia, Shanghai (CN); Liangzhi Xie, Shanghai (CN); and Xuejun Li, Shanghai (CN)
Assigned to ACM Research (Shanghai) Inc., Shanghai (CN)
Filed by ACM Research (Shanghai) Inc., Shanghai (CN)
Filed on Jan. 13, 2022, as Appl. No. 17/575,244.
Application 17/575,244 is a continuation of application No. 16/092,193, granted, now 11,257,667, previously published as PCT/CN2016/078510, filed on Apr. 6, 2016.
Prior Publication US 2022/0139697 A1, May 5, 2022
Int. Cl. H01L 21/02 (2006.01); B08B 3/12 (2006.01); B08B 13/00 (2006.01); G08B 21/18 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/02057 (2013.01) [B08B 3/12 (2013.01); B08B 13/00 (2013.01); G08B 21/182 (2013.01); H01L 21/67051 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method for cleaning a semiconductor wafer comprising features of patterned structures, the method comprising:
applying liquid on the semiconductor wafer;
controlling, based on a timer, a power supply of a transducer to deliver acoustic energy to the liquid at a first frequency and a first power level for a predetermined first time period; and
controlling, based on the timer, the power supply of the transducer to deliver no acoustic energy to the liquid for a predetermined second time period, wherein the first and second time periods are alternately applied one after another for a predetermined number of cycles;
detecting a power on time of the power supply; and
shutting down the power supply when the power on time exceeds a first preset value.