US 11,967,462 B2
Capacitor component including indium and tin, and method of manufacturing the capacitor component
Yun Sung Kang, Suwon-si (KR); Su Yeon Lee, Suwon-si (KR); Won Jun Na, Suwon-si (KR); Byung Kun Kim, Suwon-si (KR); Yu Hong Oh, Suwon-si (KR); Sun Hwa Kim, Suwon-si (KR); Jae Eun Heo, Suwon-si (KR); and Hoe Chul Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Oct. 12, 2021, as Appl. No. 17/499,117.
Claims priority of application No. 10-2021-0085461 (KR), filed on Jun. 30, 2021.
Prior Publication US 2023/0005664 A1, Jan. 5, 2023
Int. Cl. H01G 4/012 (2006.01); H01G 4/008 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/012 (2013.01) [H01G 4/0085 (2013.01); H01G 4/30 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A capacitor component comprising:
a body including a dielectric layer and an internal electrode layer, a plurality of holes spaced apart from each other and disposed in the internal electrode layer, wherein a region including at least one selected from the group consisting of indium (In) and tin (Sn) is disposed in at least one of the plurality of holes; and
an external electrode disposed on the body and connected to the internal electrode layer.