US 11,967,390 B2
Apparatus with circuit-locating mechanism
Itamar Lavy, Rockville, MD (US); Chunhao Wang, Chantilly, VA (US); and Wesley B. Butler, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 28, 2022, as Appl. No. 18/059,335.
Application 18/059,335 is a continuation of application No. 16/536,470, filed on Aug. 9, 2019, granted, now 11,551,777.
Prior Publication US 2023/0087823 A1, Mar. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G11C 29/44 (2006.01); G11C 29/04 (2006.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01)
CPC G11C 29/44 (2013.01) [H01L 21/67242 (2013.01); H01L 21/67259 (2013.01); H01L 21/67282 (2013.01); H01L 21/67294 (2013.01); H01L 23/544 (2013.01); G11C 2029/0403 (2013.01)] 20 Claims
OG exemplary drawing
 
20. A semiconductor device, comprising:
a substrate;
a circuit layer over the substrate, wherein the circuit layer includes a set of components that are arranged in a repetitive pattern along at least one lateral plane;
a top metal layer over the circuit layer, wherein the top metal layer includes slots;
a filler material within the slots for providing visual references in locating and identifying defects and/or components in the circuit layer;
an encapsulant over the top metal layer, the circuit layer, and the substrate; and
wherein:
the filler material is detectable through the encapsulant.