CPC G11C 29/44 (2013.01) [H01L 21/67242 (2013.01); H01L 21/67259 (2013.01); H01L 21/67282 (2013.01); H01L 21/67294 (2013.01); H01L 23/544 (2013.01); G11C 2029/0403 (2013.01)] | 20 Claims |
20. A semiconductor device, comprising:
a substrate;
a circuit layer over the substrate, wherein the circuit layer includes a set of components that are arranged in a repetitive pattern along at least one lateral plane;
a top metal layer over the circuit layer, wherein the top metal layer includes slots;
a filler material within the slots for providing visual references in locating and identifying defects and/or components in the circuit layer;
an encapsulant over the top metal layer, the circuit layer, and the substrate; and
wherein:
the filler material is detectable through the encapsulant.
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