US 11,965,961 B2
Direct chip-on-array for a multidimensional transducer array
Baik Woo Lee, Issaquah, WA (US)
Assigned to Siemens Medical Solutions USA, Inc., Malvern, PA (US)
Filed by Siemens Medical Solutions USA, Inc., Malvern, PA (US)
Filed on Apr. 10, 2023, as Appl. No. 18/297,704.
Application 18/297,704 is a continuation of application No. 16/947,018, filed on Jul. 15, 2020, granted, now 11,656,355.
Prior Publication US 2023/0251376 A1, Aug. 10, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B06B 1/06 (2006.01); A61B 8/08 (2006.01); G01S 15/89 (2006.01)
CPC G01S 15/8993 (2013.01) [A61B 8/483 (2013.01); B06B 1/06 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A transducer array system comprising:
an acoustic array having a distribution of transducer elements, the acoustic array having a first footprint;
a dematching layer stacked with the acoustic array, the dematching layer having the transducer elements on a first side of the dematching layer where a second footprint of the dematching layer extends beyond the first footprint of the acoustic array;
a chip of an application specific integrated circuit on a second side of the dematching layer, the second side opposite the first side; and
flexible circuit material connected to the dematching layer at a region where the second footprint of the dematching layer extends beyond the first footprint of the acoustic array.