US 11,965,928 B1
Hybrid circuit thermal test vehicles, systems, and methods
Marshall J. Lise, Sunnyvale, CA (US); Travis S. Mikjaniec, Sunnyvale, CA (US); and Sean Kim, Sunnyvale, CA (US)
Assigned to Juniper Networks, Inc., Sunnyvale, CA (US)
Filed by Juniper Networks, Inc., Sunnyvale, CA (US)
Filed on Aug. 24, 2021, as Appl. No. 17/410,101.
Int. Cl. G01R 31/28 (2006.01); H05B 3/26 (2006.01)
CPC G01R 31/2875 (2013.01) [H05B 3/265 (2013.01); H05B 2203/004 (2013.01); H05B 2203/013 (2013.01); H05B 2203/016 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A thermal test vehicle comprising:
a substrate that serves as both:
an electrical insulator that resists electrical energy; and
a thermal conductor that conducts thermal energy; and
one or more resistive elements disposed on an exposed surface of the substrate, wherein:
the resistive elements extend across a majority of at least one dimension of the exposed surface of the substrate;
the exposed surface of the substrate is coupled to a circuit board; and
an additional exposed surface of the substrate is coupled to a heatsink that comprises metal.