US 11,965,852 B2
Microelectromechanical sensor and sensing module thereof
Pei-Chi Kuo, Tainan (TW); Bor-Shiun Lee, New Taipei (TW); and Ming-Fa Chen, Taoyuan (TW)
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed by INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed on Apr. 12, 2022, as Appl. No. 17/719,342.
Claims priority of application No. 111100333 (TW), filed on Jan. 5, 2022.
Prior Publication US 2023/0213466 A1, Jul. 6, 2023
Int. Cl. G01N 27/12 (2006.01); G01N 33/00 (2006.01)
CPC G01N 27/128 (2013.01) [G01N 33/0062 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A microelectromechanical sensor, comprising:
a base, comprising a substrate and a thermal insulating film on a flat top surface of the substrate, wherein the thermal insulating film comprises a bump and a thermal insulating cavity, the bump protrudes upward from the thermal insulating film, such that the thermal insulating cavity is formed within a boundary defined by an inner profile of the bump and the flat top surface, the flat top surface of the substrate and a bottom surface of the thermal insulating film are aligned and in contact on same plane;
a heater provided on the base, and the heater comprising a heating portion; and
a sensing electrode, configured to comply with a shape of the heater, the sensing electrode comprising a sensing portion, wherein the heater and the sensing electrode are adjacent and arranged in parallel at different layers along a stacking direction, and the sensing electrode is electrically insulated from the heater;
wherein, on a reference plane in the stacking direction, a projection of the sensing portion of the sensing electrode is entirely covered by a projection of the heating portion of the heater.