CPC G01N 27/128 (2013.01) [G01N 33/0062 (2013.01)] | 19 Claims |
1. A microelectromechanical sensor, comprising:
a base, comprising a substrate and a thermal insulating film on a flat top surface of the substrate, wherein the thermal insulating film comprises a bump and a thermal insulating cavity, the bump protrudes upward from the thermal insulating film, such that the thermal insulating cavity is formed within a boundary defined by an inner profile of the bump and the flat top surface, the flat top surface of the substrate and a bottom surface of the thermal insulating film are aligned and in contact on same plane;
a heater provided on the base, and the heater comprising a heating portion; and
a sensing electrode, configured to comply with a shape of the heater, the sensing electrode comprising a sensing portion, wherein the heater and the sensing electrode are adjacent and arranged in parallel at different layers along a stacking direction, and the sensing electrode is electrically insulated from the heater;
wherein, on a reference plane in the stacking direction, a projection of the sensing portion of the sensing electrode is entirely covered by a projection of the heating portion of the heater.
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