US 11,965,103 B2
Additive manufacturing of polishing pads
Yingdong Luo, San Jose, CA (US); Sivapackia Ganapathiappan, Los Altos, CA (US); Ashwin Murugappan Chockalingam, San Jose, CA (US); Daihua Zhang, Los Altos, CA (US); Uma Sridhar, Sunnyvale, CA (US); Daniel Redfield, Morgan Hill, CA (US); Rajeev Bajaj, Fremont, CA (US); Nag B. Patibandla, Pleasanton, CA (US); Hou T. Ng, Campbell, CA (US); and Sudhakar Madhusoodhanan, Sunnyvale, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 18, 2020, as Appl. No. 16/996,744.
Claims priority of provisional application 62/890,019, filed on Aug. 21, 2019.
Prior Publication US 2021/0054222 A1, Feb. 25, 2021
Int. Cl. C09D 11/107 (2014.01); B24B 37/24 (2012.01); B29C 64/112 (2017.01); B29K 33/00 (2006.01); B29K 509/02 (2006.01); B29L 31/00 (2006.01); B33Y 10/00 (2015.01); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); C09K 3/14 (2006.01)
CPC C09D 11/107 (2013.01) [B24B 37/245 (2013.01); B29C 64/112 (2017.08); B33Y 10/00 (2014.12); B33Y 40/10 (2020.01); B33Y 70/10 (2020.01); B33Y 80/00 (2014.12); C09K 3/1409 (2013.01); B29K 2033/08 (2013.01); B29K 2509/02 (2013.01); B29L 2031/736 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A formulation for three dimensional (3D) printing of a polishing layer of a polishing pad, comprising:
a parent formulation comprising:
monomer;
a dispersant comprising a polyester derivative; and
nanoparticles dispersed in the parent formulation, wherein the dispersant is less than 6 weight percent of the parent formulation, and wherein the nanoparticles are at least 45 weight percent of the parent formulation.