US 11,965,045 B2
Method of forming an etched part and a method of forming a metal plated part
Xiaojiang Wang, Saline, MI (US); Shannon Christine Bollin, South Lyon, MI (US); Robert D. Bedard, Allen Park, MI (US); Matthew Cassoli, Southgate, MI (US); and Ellen Cheng-Chi Lee, Ann Arbor, MI (US)
Assigned to Ford Global Technologies, LLC, Dearborn, MI (US)
Filed by Ford Global Technologies, LLC, Dearborn, MI (US)
Filed on May 18, 2023, as Appl. No. 18/319,746.
Application 18/319,746 is a continuation of application No. 17/025,397, filed on Sep. 18, 2020, granted, now 11,692,049.
Prior Publication US 2023/0287161 A1, Sep. 14, 2023
Int. Cl. C08F 220/18 (2006.01); B29C 64/129 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C08F 2/48 (2006.01); C08F 216/12 (2006.01); C08F 222/10 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/32 (2006.01); C23C 18/38 (2006.01); C23C 18/50 (2006.01)
CPC C08F 220/1808 (2020.02) [C08F 2/48 (2013.01); C08F 216/125 (2013.01); C08F 220/1804 (2020.02); C08F 222/102 (2020.02); C23C 18/1641 (2013.01); C23C 18/1651 (2013.01); C23C 18/2013 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C23C 18/50 (2013.01); B29C 64/129 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12)] 20 Claims
OG exemplary drawing
 
1. A method of forming an etched part, the method comprising:
forming a substrate comprising a thermoset resin, the thermoset resin comprising a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin; and
etching a surface of the substrate,
wherein the etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites is formed on an etched surface of the substrate.