CPC C08F 220/1808 (2020.02) [C08F 2/48 (2013.01); C08F 216/125 (2013.01); C08F 220/1804 (2020.02); C08F 222/102 (2020.02); C23C 18/1641 (2013.01); C23C 18/1651 (2013.01); C23C 18/2013 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C23C 18/50 (2013.01); B29C 64/129 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12)] | 20 Claims |
1. A method of forming an etched part, the method comprising:
forming a substrate comprising a thermoset resin, the thermoset resin comprising a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin; and
etching a surface of the substrate,
wherein the etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites is formed on an etched surface of the substrate.
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