US 11,964,520 B2
Packaging method for tire pressure monitoring sensor
Sheng-Hao Lee, Taipei (TW); and Shih-Yao Lin, Taipei (TW)
Assigned to SYSGRATION LTD., Taipei (TW)
Filed by Sheng-Hao Lee, Taipei (TW); and Shih-Yao Lin, Taipei (TW)
Filed on Jan. 18, 2022, as Appl. No. 17/577,380.
Claims priority of application No. 110103796 (TW), filed on Feb. 2, 2021.
Prior Publication US 2022/0242177 A1, Aug. 4, 2022
Int. Cl. B60C 23/04 (2006.01); H01Q 1/22 (2006.01)
CPC B60C 23/0491 (2013.01) [B60C 23/0447 (2013.01); H01Q 1/2241 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A packaging method for a tire pressure monitoring sensor, comprising:
a step of placing: putting a sensing transmission module into a cavity of a modeling unit, a positioning portion located in the cavity restricting the sensing transmission module from moving transversely and toward an inner bottom of the cavity;
a step of pouring: pouring a rubber compound into the cavity, the rubber compound filling the cavity, an outer surface of the sensing transmission module being coated by the rubber compound so as to form a case on the outer surface of the sensing transmission module;
a step of hardening: the case being hardened and integrally formed with the sensing transmission module so as to form a tire pressure monitoring sensor, the tire pressure monitoring sensor being removed from the cavity;
wherein the sensing transmission module includes a circuit board a wireless antenna, a battery emit, an air pressure sensor unit and a control unit, the wireless antenna, the battery unit, the air pressure sensor unit and the control unit are electrically connected to the circuit board, the air pressure sensor unit includes an air pressure hole, the positioning portion includes a plug;
in the step of placing the plug partially extends into the air pressure hole the plug is partially located in the cavity so as to form a gap between the sensing transmission module and the inner bottom of the cavity;
in the step of pouring, the rubber compound does not flow to the air pressure hole because of the plug, the rubber compound is located around the plug in the cavity and forms a passage of the case, the rubber compound fills the gap between the sensing transmission module and the inner bottom of the cavity, and
in the step of hardening, the tire pressure monitoring sensor is removed from the cavity, the passage communicates with the air pressure hole.