US 11,964,471 B2
Substrate treating apparatus and substrate treating method using the same
Dong Yun Lee, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Sep. 21, 2022, as Appl. No. 17/949,213.
Claims priority of application No. 10-2021-0147103 (KR), filed on Oct. 29, 2021.
Prior Publication US 2023/0133599 A1, May 4, 2023
Int. Cl. B41J 11/42 (2006.01); B41J 2/045 (2006.01); B41J 11/00 (2006.01); B41J 11/55 (2006.01); B41J 25/00 (2006.01); H05K 3/12 (2006.01)
CPC B41J 11/42 (2013.01) [B41J 2/04505 (2013.01); B41J 2/04526 (2013.01); B41J 2/04556 (2013.01); B41J 11/008 (2013.01); B41J 11/55 (2013.01); B41J 25/001 (2013.01); H05K 3/125 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, comprising:
a stage extending in a first direction, configured to move a substrate in the first direction, and having an air floating system;
a gantry arranged on the stage to extend in a second direction crossing the first direction;
a head module installed on the gantry and movable in the second direction; and
a displacement sensor installed in the head module and configured to measure a separation distance between the substrate and the stage,
wherein at a first position, the head module ejects ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage, and
at a second position that is different from the first position, the head module ejects ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage.