US 11,964,357 B2
Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus
Seungchul Han, Suwon-si (KR); Yonghee Lee, Suwon-si (KR); Taemin Earmme, Suwon-si (KR); Byoungho Kwon, Suwon-si (KR); and Kuntack Lee, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 5, 2022, as Appl. No. 17/857,289.
Application 17/857,289 is a division of application No. 16/662,439, filed on Oct. 24, 2019, granted, now 11,471,996.
Claims priority of application No. 10-2019-0051237 (KR), filed on May 2, 2019.
Prior Publication US 2022/0331931 A1, Oct. 20, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 37/005 (2012.01); B24B 37/20 (2012.01)
CPC B24B 37/005 (2013.01) [B24B 37/20 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A conditioner of a chemical mechanical polishing (CMP) apparatus, the conditioner comprising:
a disk to polish a polishing pad of the CMP apparatus;
a driver to rotate the disk;
a lifter to lift the driver;
an arm to rotate the lifter;
a connector to connect the driver to the lifter, the driver and the lifter being connected to vertically non-overlapping portions of the connector such that the driver is tiltable with respect to the lifter; and
an airbag mechanism in the connector, the airbag mechanism including at least two airbags in the connector.