US 11,964,309 B2
Substrate treatment apparatus and method
Sung Hun Eom, Gyeonggi-do (KR); Sung Ho Lee, Gyeonggi-do (KR); and Ju Yong Jang, Gyeonggi-do (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on May 6, 2022, as Appl. No. 17/738,010.
Claims priority of application No. 10-2021-0117867 (KR), filed on Sep. 3, 2021.
Prior Publication US 2023/0071392 A1, Mar. 9, 2023
Int. Cl. B08B 13/00 (2006.01); B08B 3/12 (2006.01); B08B 5/02 (2006.01)
CPC B08B 3/123 (2013.01) [B08B 5/023 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate treatment apparatus comprising:
a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and
a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution; and
a gas supply unit configured to supply gas to the substrate, the gas supply unit comprising a cylindrical body and a plurality of gas outlets formed in a side surface of the body, wherein each of the gas outlets extends in a longitudinal direction of the body,
wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film, and
the gas supply unit is disposed above the first bath, and the substrate is disposed between the first bath and the gas supply unit such that the other surface of the substrate faces the gas supply unit, to prevent contamination of the other surface of the substrate by supplying gas to the other surface of the substrate.