US 11,515,347 C1 (12,575th)
Dam of image sensor module having sawtooth pattern and inclined surface on its inner wall and method of making same
Wei-Feng Lin, Hsinchu (TW); En-Chi Li, Hsinchu (TW); and Chi-Chih Huang, Taoyuan (TW)
Filed by Wei-Feng Lin, Hsinchu (TW); En-Chi Li, Hsinchu (TW); and Chi-Chih Huang, Taoyuan (TW)
Assigned to OMNIVISION TECHNOLOGIES, INC., Santa Clara, CA (US)
Reexamination Request No. 90/019,251, Sep. 13, 2023.
Reexamination Certificate for Patent 11,515,347, issued Nov. 29, 2022, Appl. No. 16/747,130, Jan. 20, 2020.
Ex Parte Reexamination Certificate issued on Apr. 15, 2024.
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14623 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01)]
OG exemplary drawing
AS A RESULT OF REEXAMINATION, IT HAS BEEN DETERMINED THAT:
Claims 5-6 are cancelled.
Claims 1-4 and 7-9 are determined to be patentable as amended.
New claims 10-17 are added and determined to be patentable.
1. An image sensor module comprising:
an image sensor having a light sensing area;
a cover glass for covering the light sensing area, wherein a surface of the image sensor is parallel to a surface to [ of ] the cover glass;
a dam between the image sensor and the cover glass, surrounding the light sensing area, having an outer wall and an inner wall, wherein a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern;
wherein a space separates the dam and the light sensing area;
wherein a top of the dam is attached to the cover glass and a bottom of the dam is attached to the image sensor; and
wherein incident light arrives at the inner wall of the dam and the inner wall having the sawtooth pattern reduces reflected incident light toward the light sensing area . [ ;
wherein a cross-section of the inner wall of the dam between the image sensor and the cover glass orthogonal to the surface of the light sensing area of the image sensor forms a curved surface; and
wherein incident light arrives at the inner wall of the dam and the inner wall having the curved surface reflects the incident light toward side of the image sensor.]
2. The image sensor [ module ] of claim 1 further comprising:
a substrate having a first side and a second side;
wherein:
the second side is opposite to the first side;
the image sensor is disposed on the first side of the substrate;
the image sensor is wire bonded by wires to pads on the first side of the substrate;
a plurality of solder balls are attached to the second side of the substrate.
3. The image sensor [ module ] of claim 2 further comprising:
an encapsulant disposed on the first side of the substrate covering the wires, the substrate, and a part of the image sensor outside the dam.
4. The image sensor [ module ] of claim 3, wherein the encapsulant is black.
7. The image sensor [ module ] of claim 1, wherein a thickness between the cover glass and the image sensor of the dam is less than 40 μm.
8. The image sensor [ module ] of claim 1, wherein the dam is made of a dry film attached to the cover glass.
9. The image sensor [ module ] of claim 8, wherein the dry film is a photo lithographic material.
[ 10. An image sensor module comprising:
an image sensor having a light sensing area;
a cover glass for covering the light sensing area, wherein a surface of the image sensor is parallel to a surface of the cover glass;
a dam between the image sensor and the cover glass, surrounding the light sensing area, having an outer wall and an inner wall, wherein a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern;
wherein a space separates the darn and the light sensing area;
wherein a top of the dam is attached to the cover glass and a bottom of the dam is attached to the image sensor; and
wherein incident light arrives at the inner wall of the dam and the inner wall having the sawtooth pattern reduces reflected incident light toward the light sensing area;
a substrate having a first side and a second side
wherein:
the second side is opposite to the first side;
the image sensor is disposed on the first side of the substrate;
the image sensor is wire bonded by wires to pads on the first side of the substrate;
plurality of solder balls are attached to the second side of the substrate;
the image sensor is electrically coupled to the solder balls through the wires;
the solder balls electrically couple the image sensor to outside image sensor module.]
[ 11. The image sensor module of claim 10 further comprising:
an encapsulant disposed on the first side of the substrate covering the wires, the substrate, and a part of the image sensor outside the dam.]
[ 12. The image sensor module of claim 11, wherein the encapsulant is black.]
[ 13. The image sensor module of claim 10, wherein a cross-section of the inner wall of the dam between the image sensor and the cover glass orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.]
[ 14. The image sensor module of claim 10, wherein a cross-section of a wall of the dam between the image sensor and the cover glass orthogonal to the surface of the light sensing area of the image sensor has a wider part next to the cover glass and a narrower part next to the image sensor.]
[ 15. The image sensor module of claim 10, wherein a thickness between the cover glass and the image sensor of the dam is less than 40 μm.]
[ 16. The image sensor module of claim 10, wherein the dam is made of a dry film attached to the cover glass.]
[ 17. The image sensor module of claim 16, wherein the dry film is a photo lithographic material.]