US 11,948,807 B2
Feature selection through solder-ball population
Matthew Doyle, Chatfield, MN (US); Thomas W. Liang, Rochester, MN (US); Layne A. Berge, Rochester, MN (US); John R. Dangler, Rochester, MN (US); Jason J. Bjorgaard, Rochester, MN (US); Kyle Schoneck, Rochester, MN (US); and Matthew A. Walther, Rochester, MN (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Mar. 30, 2021, as Appl. No. 17/216,932.
Prior Publication US 2022/0319867 A1, Oct. 6, 2022
Int. Cl. H01L 21/48 (2006.01); H05K 3/40 (2006.01)
CPC H01L 21/485 (2013.01) [H05K 3/4007 (2013.01); H05K 2203/043 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method comprising:
identifying a set of features for a product;
determining that preventing an electrical connection at a target ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features, wherein the target ball-grid-array location comprises a set of vias that does not include all vias in the ball-grid-array assembly;
applying, during reflow of the ball-grid-array assembly, suction to the set of vias at the target BGA location; and
drawing, with the application of suction, a set of solder balls at the target BGA location into the set of vias.