CPC H01L 21/485 (2013.01) [H05K 3/4007 (2013.01); H05K 2203/043 (2013.01)] | 16 Claims |
1. A method comprising:
identifying a set of features for a product;
determining that preventing an electrical connection at a target ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features, wherein the target ball-grid-array location comprises a set of vias that does not include all vias in the ball-grid-array assembly;
applying, during reflow of the ball-grid-array assembly, suction to the set of vias at the target BGA location; and
drawing, with the application of suction, a set of solder balls at the target BGA location into the set of vias.
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