US 11,947,321 B2
Mold for making alkali metal wax packet, method for preparing same, and method for using same
Xinghui Li, Beijing (CN); Ting Du, Beijing (CN); Haijun Chen, Beijing (CN); Zhongzheng Liu, Beijing (CN); and Shunlu Xiao, Beijing (CN)
Assigned to BEIJING VACUUM ELECTONICS RESEARCH INSTITUTE, Beijing (CN)
Appl. No. 17/780,675
Filed by BEIJING VACUUM ELECTONICS RESEARCH INSTITUTE, Beijing (CN)
PCT Filed Nov. 26, 2020, PCT No. PCT/CN2020/131785
§ 371(c)(1), (2) Date May 27, 2022,
PCT Pub. No. WO2021/104375, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 201911195820.X (CN), filed on Nov. 28, 2019.
Prior Publication US 2023/0139149 A1, May 4, 2023
Int. Cl. G04D 3/00 (2006.01); G04F 5/14 (2006.01)
CPC G04D 3/0069 (2013.01) [G04F 5/145 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A mold assembly for making alkali metal wax packets, wherein the mold assembly comprises packaging molds, the packaging mold comprising a silicon substrate forming a main body of the packaging mold;
the silicon substrate comprising:
a mold isolator at the edge of the silicon substrate; and
a silicon substrate central portion formed by a recess in the upper surface of the silicon substrate in an area enclosed by the mold isolator;
a plurality of wax packet receiving cavities being formed by indentations of the upper surface of the silicon substrate central portion;
a cavity isolator between adjacent wax packet receiving cavities;
a release sacrificial layer formed on the upper surface of the silicon substrate, a paraffin layer formed on the upper surface of the release sacrificial layer away from the silicon substrate;
cavities for receiving alkali metal formed on a side of the paraffin layer away from the release sacrificial layer; and
corrosion release holes formed in the mold isolator, the corrosion release holes configured to allow a corrosive liquid pass through to corrode and dissolve the release sacrificial layer.