CPC G01L 1/18 (2013.01) [B81B 7/02 (2013.01); B81C 1/00246 (2013.01); G01L 1/14 (2013.01); G01L 1/16 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2201/013 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0714 (2013.01); B81C 2203/0728 (2013.01)] | 20 Claims |
1. A microelectromechanical (“MEMS”) force sensor, comprising:
a sensor die operable to receive an applied force, wherein the sensor die comprises a top surface and a bottom surface opposite thereto;
a sensing element at the bottom surface of the sensor die, the sensing element operable to convert a strain to a signal that is proportional to the strain; and
circuitry at the bottom surface of the sensor die, the circuitry operable to receive the signal from the sensing element and provide an output code based on a plurality of predetermined force thresholds.
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