US 11,946,127 B2
Cu—Ti-based copper alloy sheet material, method for producing the same, electric current carrying component, and heat radiation component
Takuya Hashimoto, Tokyo (JP); Hiroshi Yorifuji, Tokyo (JP); and Hiroshi Hyodo, Tokyo (JP)
Assigned to DOWA METALTECH CO., LTD., Tokyo (JP)
Filed by DOWA METALTECH CO., LTD., Tokyo (JP)
Filed on Mar. 8, 2023, as Appl. No. 18/118,793.
Claims priority of application No. 2022-055205 (JP), filed on Mar. 30, 2022; and application No. 2022-122576 (JP), filed on Aug. 1, 2022.
Prior Publication US 2023/0313343 A1, Oct. 5, 2023
Int. Cl. C22C 9/00 (2006.01); C22F 1/08 (2006.01)
CPC C22C 9/00 (2013.01) [C22F 1/08 (2013.01); Y10T 428/12431 (2015.01)] 13 Claims
OG exemplary drawing
 
1. A copper alloy sheet material, having a composition comprising, in mass %, Ti: 1.0 to 5.0%, Al: 0.5 to 3.0%, Ag: 0 to 0.3%, B: 0 to 0.3%, Be: 0 to 0.15%, Co: 0 to 1.0%, Cr: 0 to 1.0%, Fe: 0 to 1.0%, Mg: 0 to 0.5%, Mn: 0 to 1.5%, Nb: 0 to 0.5%, Ni: 0 to 1.0%, P: 0 to 0.2%, Si: 0 to 0.5%, Sn: 0 to 1.5%, V: 0 to 1.0%, Zn: 0 to 2.0%, Zr: 0 to 1.0%, and S: 0 to 0.2%, the total content of Ag, B, Be, Co, Cr, Fe, Mg, Mn, Nb, Ni, P, Si, Sn, V, Zn, Zr, and S among the elements being 3.0% or less, and balance of Cu, with unavoidable impurities, wherein in an observation plane parallel to a sheet surface, a maximum width of a grain boundary reaction type precipitate existing region is 1000 nm or less, a KAM value is 3.0° or less when a boundary with a crystal orientation difference of 15° or more in the measurement with a step size of 0.1 μm by EBSD (electron backscatter diffraction) of the observation plane parallel to the sheet surface is regarded as a crystal grain boundary, and a tensile strength in a rolling direction is 850 MPa or more.