	US 11,945,894 B2
	Dielectric film-forming composition
Binod B. De, Attleboro, MA (US); William A. Reinerth, Riverside, RI (US); Sanjay Malik, Attleboro, MA (US); Stephanie Dilocker, Attleboro, MA (US); and Raj Sakamuri, Sharon, MA (US)
Assigned to Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US)
Filed by Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US)
Filed on Jun. 21, 2021, as Appl. No. 17/352,484.
Claims priority of provisional application 63/047,560, filed on Jul. 2, 2020.
Prior Publication US 2022/0002463 A1, Jan. 6, 2022
Int. Cl. C08F 279/02 (2006.01); C08J 5/18 (2006.01); C08L 51/00 (2006.01); C09D 11/101 (2014.01); C09D 11/107 (2014.01); C09D 151/04 (2006.01); C25D 5/56 (2006.01)

CPC C08F 279/02 (2013.01) [C08J 5/18 (2013.01); C08L 51/003 (2013.01); C09D 11/101 (2013.01); C09D 11/107 (2013.01); C09D 151/04 (2013.01); C25D 5/56 (2013.01); C08J 2351/00 (2013.01)]

14 Claims

1. A dielectric film-forming composition, comprising:

a) at least one cyclized polydiene resin having a substituted or unsubstituted alkenyl group;

b) at least one reactive functional compound having at least two functional groups capable of reacting with the substituted or unsubstituted alkenyl group on cyclized polydiene resin; and

c) at least one catalyst capable of inducing reaction of the cyclized polydiene resin with the reactive functional compound,

wherein the at least one cyclized polydiene resin is in an amount of from about 2 wt % to about 40 wt % of the composition.