US 11,944,968 B2
Microfluidic chips with integrated electronic sensors
Sufi Zafar, Briarcliff Manor, NY (US); Yuksel Temiz, Zug (CH); and Emmanuel Delamarche, Thalwil (CH)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jul. 7, 2022, as Appl. No. 17/811,096.
Application 17/811,096 is a division of application No. 16/775,777, filed on Jan. 29, 2020, granted, now 11,453,001.
Prior Publication US 2022/0362768 A1, Nov. 17, 2022
Int. Cl. B01L 3/00 (2006.01)
CPC B01L 3/502715 (2013.01) [B01L 2200/0684 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0861 (2013.01); B01L 2300/12 (2013.01); B01L 2300/165 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method, comprising:
depositing a conductive plug onto a substrate surface;
forming, via an additive process, a microfluidic channel and a reference fluid holding chamber on the substrate surface such that a wall between the microfluidic channel and the reference fluid holding chamber extends across the conductive plug; and
depositing an electrode on the substrate surface, wherein the forming the fluid holding chamber results in a wall of the reference fluid holding chamber extending across the electrode.