US 11,943,954 B2
Encapsulation structure and encapsulation method for flexible organic light-emitting diode device
Wenzhi Zhang, Hubei (CN)
Assigned to Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan (CN)
Appl. No. 16/966,037
Filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Hubei (CN)
PCT Filed Mar. 16, 2020, PCT No. PCT/CN2020/079460
§ 371(c)(1), (2) Date Jul. 30, 2020,
PCT Pub. No. WO2021/098091, PCT Pub. Date May 27, 2021.
Claims priority of application No. 201911124495.8 (CN), filed on Nov. 18, 2019.
Prior Publication US 2023/0180509 A1, Jun. 8, 2023
Int. Cl. H10K 50/844 (2023.01); H10K 71/00 (2023.01); H10K 102/00 (2023.01)
CPC H10K 50/844 (2023.02) [H10K 71/00 (2023.02); H10K 2102/311 (2023.02)] 10 Claims
OG exemplary drawing
 
1. An encapsulation structure for a flexible organic light-emitting diode (OLED) device, comprising an organic matter protective layer, one or more continuous organic flat layers, one or more inorganic barrier layers, and one or more organic layers sequentially disposed on the OLED device;
wherein an outermost surface of each of the organic layers is treated with plasma to become a surface hardened layer, and the surface hardened layer and an unhardened portion of the organic layer form an organic barrier layer;
wherein a material of the organic matter protective layer comprises polytetrafluoroethylene, polyvinylidene fluoride, or polyvinyl fluoride; and
wherein an opening of the organic flat layer is smaller than an opening of the organic matter protective layer.