US 11,943,953 B2
Organic light emitting diode and fabricating method thereof
Anxing Zhong, Wuhan (CN)
Assigned to WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Wuhan (CN)
Appl. No. 16/966,009
Filed by WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Wuhan (CN)
PCT Filed Jan. 14, 2020, PCT No. PCT/CN2020/071894
§ 371(c)(1), (2) Date Jul. 30, 2020,
PCT Pub. No. WO2021/134831, PCT Pub. Date Jul. 8, 2021.
Claims priority of application No. 201911409910.4 (CN), filed on Dec. 31, 2019.
Prior Publication US 2023/0180508 A1, Jun. 8, 2023
Int. Cl. H10K 50/844 (2023.01); H10K 71/00 (2023.01)
CPC H10K 50/844 (2023.02) [H10K 71/00 (2023.02)] 17 Claims
OG exemplary drawing
 
1. A fabricating method of an organic light emitting diode, comprising following steps of:
providing a substrate layer;
forming a first electrode layer on the substrate layer;
forming a blended active layer on a surface of the first electrode layer facing away from the substrate layer, wherein the blended active layer comprises a light emitting layer and a first packaging layer, and the first packaging layer covers a surface of the light emitting layer; and
forming a second electrode layer on a surface of the first packaging layer facing away from the first electrode layer.